China Thermal Interface Materials manufacturer & supplier

BERGQUIST HI-FLOW 225-UT HI-FLOW THF 700UT

HF225UT

• Thermal impedance: 0.08°C-in.2/W (at 25 psi)
• 55°C phase change composite with inherent tack characteristics
• High-visibility protective

2022-01-15

BERGQUIST SIL PAD TSP 1600 SIL PAD 800

SP800

• Thermal impedance: 0.45°C-in.2/W
(at 50 psi)
• High-value material
• Smooth and highly compliant surface
• Electrically isolating

2022-01-15

BERGQUIST Q PAD II SIL PAD TSP Q2500 BERGQUIST QII

Features and Benefits
• Thermal impedance: 0.22°C-in.2/W
(at 50 psi)
• Maximum heat transfer
• Aluminum foil-coated both sides

2022-01-15

BERGQUIST GPHC5.0 GAP PAD TGP HC5000

GAP PAD HC5.0

• Thermal conductivity: 5.0 W/m-K
• High-compliance, low compression stress
• Fiberglass reinforced for shear and tear resistance

2022-01-15

BERGQUIST GAP PAD HC 3.0 GAP PAD TGP HC3000

GPHC3.0

BERGQUIST GPHC3.0 Features and Benefits
• Thermal conductivity: 3.0 W/m-K
• High-compliance, low
compression stress
• Fiberglass-reinf

2022-01-15

BERGQUIST SPK4 SIL PAD TSP K900 SIL PAD K-4

• Thermal impedance: 0.48°C-in. 2 /W
(at 50 psi)
• Withstands high voltages
• High dielectric strength
• Very durable

2022-01-18

BERGQUIST SPK6 SIL PAD K-6

• Thermal impedance: 0.49°C-in.2/W
(at 50 psi)
• Physically strong dielectric barrier
against cut-through
• Medium-performance film

2022-01-15

BERGQUIST LF3500 LIQUI-FORM 3500 LIQUI FORM TLF LF3500

● Thermal Conductivity: 3.5 W/m-K
● Dispensable pre-cured gel
● Stable viscosity in storage and in the application

2022-01-15

BERGQUIST SPK10 SIL PAD TSP K1300 SIL PAD K-10

• Thermal impedance: 0.41°C-in. 2 /W
(at 50 psi)
• Tough dielectric barrier against
cut-through
• High performance film

2022-01-15

Bergquist SPA1500 Sil-PadA1500 SIL PAD TSP A2000

• Thermal impedance:
0.42°C-in 2 /W (@50 psi)
• Elastomeric compound coated on
both sides

2022-01-15

Laird Tflex 300 Tflex 320H

Features and Benefits
Extreme compliancy allows material to "totally blanket" component(s)
Low compression set enables the pad to be reused many

2022-01-15

Laird Tgard K52 Laird performance materials

Thermally Conductive Insulators

2022-01-15

BERGQUIST GP1500 GAP PAD 1500 Gap Filling Material

Thermal Conductive Silicone Gasket

2022-01-15

BERGQUIST SP900S SIL PAD TSP 1600S SIL PAD 900S

• Thermal impedance: 0.61°C-in. 2 /W
(at 50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface

2022-01-15

BERGQUIST SP1200 SIL PAD TSP 1800 Sil-Pad 1200

• Thermal Impedance:0.53 o C-in 2 /W
(@ 50 psi)
• Exceptional thermal performance at lower
application pressures
• Smooth and non-tacky

2022-01-18

BERGQUIST GPHC3.0 GAP PAD TGP HC3000

• Thermal conductivity: 3.0 W/m-K
• High-compliance, low
compression stress
• Fiberglass-reinforced for shear and tear
resistance

2022-02-19