BERGQUIST  SIL PAD  TSP 1600S  Formerly known as SIL PAD  900S

High Performance Insulator for Low-Pressure Applications

Features and Benefits
• Thermal impedance: 0.61°C-in. 2 /W
(at 50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface
material solution

The true workhorse of the SIL PAD product family, BERGQUIST  SIL PAD TSP 1600S thermally conductive
insulation material is designed for a  wide variety of applications requiring  high thermal performance and electrical
isolation. These applications also typically  have low mounting pressures for  component clamping.
BERGQUIST  SIL PAD  TSP 1600S material  combines a smooth and highly compliant  surface characteristic with high thermal
conductivity. These features optimize  the thermal resistance properties at  low pressures.

Applications requiring low component  clamping forces include discrete  semiconductors (TO-220, TO-247 and
TO-218) mounted with spring clips.  Spring clips assist with quick assembly  and apply a limited amount of force
to the semiconductor. The smooth  surface texture of BERGQUIST  SIL PAD 900S minimizes interfacial thermal
resistance and maximizes thermal  performance.

BERGQUIST SP900S Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive