BERGQUIST HI-FLOW THF 700UT is designed as a pressure-sensitive thermal

interface material for use between a high performance processor and a heat sink.

BERGQUIST  HI-FLOW 225-UT is a thermally conductive 55°C phase change

composite with inherent tack. The material is supplied on a polyester carrier

liner and is available with high-visibility  protective tabs.

Above its phase change temperature,BERGQUIST  HI-FLOW THF 700UT wetsout

the thermal interface surfaces and  flows to produce the lowest thermal impedance. 

The material requires  pressure of the assembly to cause flow.

BERGQUIST HF225UT Typical Applications Include:

• Computers and peripherals

• High-performance computer processors

• Graphic cards

• Power modules

Configurations Available:

• Roll form with tabs, kiss-cut parts – no holes

BERGQUIST HF225UT is limited to a square or rectangular part design.

Dimensional tolerance is ± 0.020 in. (0.5 mm).