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Shenzhen Hothree Technology Co., Ltd
Shenzhen Hothree Technology Co., Ltd  

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Company Info

Shenzhen Hothree Technology Co., Ltd [China (Mainland)]


Business Type:Manufacturer, Agent
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

China Thermal Interface Materials manufacturer & supplier

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  • BERGQUIST SP400 SIL PAD 400 SIL PAD TSP 900

BERGQUIST SP400 SIL PAD 400 SIL PAD TSP 900

• Thermal impedance: 1.13°C-in. 2 /W
(at 50 psi)
• Original SIL PAD ® material
• Excellent mechanical and
physical characteristics

2022-01-15

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  • BERGQUIST GP5000S35 GAP PAD TGP 5000 GAP PAD 5000S35

BERGQUIST GP5000S35 GAP PAD TGP 5000 GAP PAD 5000S35

Thermal Conductive Sheet Silica Gel Cooling Pad

2022-01-15

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  • BERGQUIST GP3000S30 Gap Pad 3000S30

BERGQUIST GP3000S30 Gap Pad 3000S30

Thermal Conductive Insulating Silicone Gasket

2022-01-15

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  • Bergquist BP100 BOND-PLY 100 Thermal pad

Bergquist BP100 BOND-PLY 100 Thermal pad

Thermally Conductive Adhesive Tape

2022-02-19

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  • Laird Tflex300 Laird Tflex360

Laird Tflex300 Laird Tflex360

Thermal Conductive Insulating Silicone Gasket

2022-01-15

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  • BERGQUIST GP2500S20 Gap Pad 2500S20

BERGQUIST GP2500S20 Gap Pad 2500S20

Thermal Conductive Sheet Silica Gel Cooling Pad

2022-01-15

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  • BERGQUIST PP400 Poly-Pad 400

BERGQUIST PP400 Poly-Pad 400

Thermally Conductive Adhesive Tape

2022-01-15

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  • BERGQUIST SP1500ST SIL-PAD 1500ST

BERGQUIST SP1500ST SIL-PAD 1500ST

● Thermal impedance: 0.23ºC-in 2 /W @ 50 psi
● Naturally tacky on both sides
● Pad is repositionable
● Excellent thermal performance

2022-01-15

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  • Bergquist GF3500S35 GAP FILLER 3500S35 GAP FILLER TGF3600

Bergquist GF3500S35 GAP FILLER 3500S35 GAP FILLER TGF3600

1.Thixotropic nature makes it easy to dispense
2.Two part formulation for easy storage
3. Ultra conforming designed for fragile and low stres

2022-01-15

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  • BERGQUIST GPVO GAP PAD TGP 800VO GAP PAD VO

BERGQUIST GPVO GAP PAD TGP 800VO GAP PAD VO

Gad pad VO

• Thermal conductivity: 0.8 W/m-K
• Enhanced puncture, shear and
tear resistance
• Conformable gap filling material
• Electrically isolating

2022-01-15

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  • BERGQUIST GAP PAD TGP 1000VOUS GAP PAD VO ULTRA SOFT

BERGQUIST GAP PAD TGP 1000VOUS GAP PAD VO ULTRA SOFT

GPVOUS

• Thermal conductivity: 1.0 W/m-K
• Highly conformable,low hardness
• "Gel-like"modulus
• Decreased strain
• Puncture,shear and tear resist

2022-01-15

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  • BERGQUIST SP1000L SIL-PAD 1000L SIL PAD TSP 1700L

BERGQUIST SP1000L SIL-PAD 1000L SIL PAD TSP 1700L

Sil pad1000AC

● Thermal impedance: 1.13ºC-in 2 /W @ 50 psi
● Original Sil-Pad material
● Excellent mechanical and physical characteristics
● Flame retardant

2022-01-15

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  • BERGQUIST HF300P HI-FLOW 300P HI-FLOW THF 1600P

BERGQUIST HF300P HI-FLOW 300P HI-FLOW THF 1600P

Hi Flow 300P

• Thermal impedance: 0.13°C-in.2/W
(at 25 psi)
• Field-proven polyimide film; excellent
dielectric performance; excellent cutthrough
res

2022-01-15

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  • BERGQUIST SP2000 Sil-Pad 2000 SIL PAD TSP 3500

BERGQUIST SP2000 Sil-Pad 2000 SIL PAD TSP 3500

SIL PAD2000

Features and Benefits
• Thermal impedance: 0.33°C-in.2/W
(at 50 psi)
• Optimal heat transfer
• High thermal conductivity: 3.5 W/m-K

2021-11-13

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