BERGQUIST  SIL-PAD 1000L  FEATURES AND BENEFITS ● Thermal impedance: 1.13ºC-in 2 /W @ 50 psi ● Original Sil-Pad material ● Excellent mechanical and physical characteristics ● Flame retardant BERGQUIST SP1000LAC TYPICAL APPLICATIONS ● Mount heat sink onto BGA graphic processor or drive processor ● Mount heat spreader onto power converter PCB or onto motor control PCB BERGQUIST SIL PAD TSP 1700L material is designed for applications where low mounting pressure is used and low thermal resistance is required. BERGQUIST SIL PAD TSP 1700L achieves this with the combination of a smooth surface design and high thermal conductivity (dielectric) silicone rubber . Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips provide quick assembly but apply a limited amount of pressure to the semiconductor. The smooth surface texture of BERGQUIST SIL PAD TSP 1700L minimizes interfacial thermal resistance and maximizes thermal performance.